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| Part NO. : | MIOC-15-09-09–N-series |
| Datasheet : |
|
| Availability : | In store |
(Y waveguide modulators)
1550nm integrated optical chips ( Y waveguide) input/output: 125/250um PM fiber,1mfiber length, without connector
Features
X-Cut, y-propagating LiNbO3
Very low insertion loss.
APE process for waveguide, works in single polarization
High extinction ratio
Fiber is sloping coupled with waveguide, which deduce optical return far and away
Push-pull electrode design may deduce half wave Voltage
Small packaging and lightweight
Excellent long-term stability
Applications
It is for attitude control of movements such as aircrafts, ships, guided missiles, automobiles etc
in the fiber gyroscope system, Hydrophone and other optic sensitive fields. Faraday Effect was used to measure current through fiber circuit in the current sensing system.
Chip structure
Specifications
|
Parameter |
Unit |
Values |
|
Wavelength |
nm |
1550 |
|
Insertion |
dB |
≤4.0 |
|
Half wave Voltage |
V |
≤4.5 |
|
Splitting Beam Ratio |
- |
47/53－53/47 |
|
Optical Return |
dB |
≥50 |
|
Polarization extinction ,chip |
dB |
≥55 |
|
Additional Intensity Modulating |
- |
≤0.2% |
|
PM Pigtail Crosstalk |
dB |
≤-30 |
|
Electrode type |
- |
Push-pull modulating |
|
Bandwidth |
MHz |
≥300 |
|
Pigtail type |
- |
PM |
|
Work temperature |
℃ |
-40～+70 |
|
Packaging dimensions |
mm |
30X8X5 or 35X10X5 |
Package outline
Operation Instructions
a. If the devices work under the single state of polarization, the polarization state of input light must conform to devices.
b. Avoid the Electrical damage of the devices; the electrode voltage of modulators should be lower 30V.
c. Applying too much force to fiber may cause it broking easily. Avoid drawing、twisting.
Bending radius must not be less than 30nm.
d. Avoid too much force between metal tube and fibers. Put up the tube and the fibers together when using it. Avoid bending at the joint of the tube and the fibers.
e. Storage environment humidity must be less than 50%, and not contain the materials which damages devices.
f. Avoid the devices suffering from intense thermal shock and inhomogeneous by heated
g. Avoid stressing to the joint of the fiber connection circuits.
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