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| Part NO. : | DWDMFBG –series |
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IDP's High Power Diode Laser Modules are manufactured by adopting specialized fiber-coupling techniques, resulting in volume products with a high efficiency, stability and superior beam quality. The products are achieved by transforming the asymmetric radiation from the laser diode chip into an output fiber with small core diameter by using special micro optics. Inspecting and burn-in procedures in every aspect come to a result to guarantee each product with the reliability, stability and long lifetime.
Our research staffs are constantly improving and innovating the processing technology in the producing process, based on the professional knowledge and experience accumulated in long-terms. We are also continuously developing new products to meet customers’ specific needs.
At Idealphotonics, to provide high quality products with reasonable price is our always goal.
Features
160mW output power
60µm fiber core diameter
0.22N.A.
405nm wavelength
Applications
Printing
Biochemical Analysis
Scientific Research
Specification
Specifications（25℃）
Symbol
Unit
K405E03FN-0.160W
Optical Data
CW-Output Power
Po
mW
160
Center Wavelength
c
nm
405
Tolerance of
-
nm
±5
Spectral Width (FWHM)
△
nm
<3
Temperature Drift of
-
nm/℃
~0.2
Fiber Data (1)
Fiber Core Diameter
Wc
µm
60
Numerical Aperture
N.A.
-
0.22
Fiber Connector
-
-
SMA-905
Electrical Data
Operating Current
Iop
mA
125
Threshold Current
Ith
mA
26
Slope Efficiency
η D
mW/mA
1.6
Operating Voltage
Vop
V
5±0.5
Reverse Voltage
Vre
V
5
Others
Operating Temperature
Top
℃
10~30
Storage Temperature
Tst
℃
-20~+70
Expected Lifetime
MTTF
h
>10,000
Dimensions (fiber and connector not included)
-
mm
8.5×7.5×10.7
Lead Soldering Temperature
Tis
℃
260(10 sec.)
Characteristics
Typ. spectrum (T=25℃)
Package Dimensions (mm)
Operating notes
Avoid eye exposure to direct or scattered radiation.
ESD precautions must be taken.
Please connect pins to wires by solder instead of using socket when operation
current is higher than 6A.
Soldering point should be close to the root of the pins. Soldering temperature
should be lower than 260℃
and time shorter than 10 second.
Use constant current power supply. Avoid surge current.
Laser diode must be used according to the specifications.
Laser diode must work with good cooling.
A minimum bend radius should be 300 times greater than the fiber cladding
diameter.
Operation temperature is 10℃~ 30℃.
Storage: -20℃~ +70℃, all pins short-circuit.
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