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Part NO. : | DWDMFBG –series |
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Description
Specifications(25℃)
Symbol
Unit
K650E03
K650E03
OpticalData
CW-Output
Po
mW
2
10
Center
lc
nm
650
Tolerance of l
-
nm
±5
Spectral
△l
nm
<3
Temperature Drift of l
-
nm/℃
~0.2
FiberData (1)
Fiber Core
Wc
µm
4
105
Numerical
N.A.
-
0.13
0.22
Fiber
-
-
SMA-905
Electrical Data
Operating
Iop
mA
29
57
Threshold
Ith
mA
20
42
Slope
η D
mW/mA
0.25
0.66
Operating
Vop
V
2.2
Reverse Voltage
Vre
V
2
PD Data
Current
Imo
µA
100~400
Others
Operating
Top
℃
10~30
Storage
Tst
℃
-20~+70
Expected
MTTF
h
>5,000
Dimensions fiber
-
mm
Φ7.4×34.0
Lead Soldering
Temperature
Tis
℃
260(10 sec.)
IDP's High Power Diode Laser Modules are manufactured by adopting specialized fiber-coupling techniques, resulting in volume products with a high efficiency, stability and superior beam quality. The products are achieved by transforming the asymmetric radiation from the laser diode chip into an output fiber with small core diameter by using special micro optics. Inspecting and burn-in procedures in every aspect come to a result to guarantee each product with the reliability, stability and long lifetime.
Our research staffs are constantly improving and innovating the processing technology in the producing process, based on the professional knowledge and experience accumulated in long-terms. We are also continuously developing new products to meet customers’ specific needs.
At Idealphotonics, to provide high quality products with reasonable price is our always goal.
Features
2mW,10mW output power
4µm,105µm fiber core diameter
0.13/0.22N.A.
650nm wavelength
Applications
Printing
Aiming beam
Specification
SN-0.002W
FN-0.010W
Power
Wavelength
Width (FWHM)
Diameter
Aperture
Connector
Current
Current
Efficiency
Voltage
Temperature
Temperature
Lifetime
and connector
not included
(1) Other fibers available upon request
Package Dimensions (mm)
Operating notes
Avoid eye exposure to direct or scattered radiation.
ESD precautions must be taken.
Please connect pins to wires by solder instead of using socket when operation current is higher than 6A.
Soldering point should be close to the root of the pins. Soldering temperature should be lower than 260℃
and time shorter than 10 second.
Use constant current power supply. Avoid surge current.
Laser diode must be used according to the specifications.
Laser diode must work with good cooling.
A minimum bend radius should be 300 times greater than the fiber cladding diameter.
Operation temperature is 10℃~ 30℃.
Storage: -20℃~ +70℃, all pins short-circuit.
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