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IDP's High Power Diode Laser Modules are manufactured by adopting specialized fiber-coupling techniques, resulting in volume products with a high efficiency, stability and superior beam quality. The products are achieved by transforming the asymmetric radiation from the laser diode chip into an output fiber with small core diameter by using special micro optics. Inspecting and burn-in procedures in every aspect come to a result to guarantee each product with the reliability, stability and long lifetime.
Our research staffs are constantly improving and innovating the processing technology in the producing process, based on the professional knowledge and experience accumulated in long-terms. We are also continuously developing new products to meet customers’ specific needs.
At Idealphotonics, to provide high quality products with reasonable price is our always goal.
Features
Output power: 5mW,10mW,30mW,50mW
Wavelength: 660nm(635nm optional)
Fiber core diameter: 4_ single model
13NA
Applications
Pilot light
Medical use
Holography technology
660nm Characteristics(25°C,50mW)
Typical Device Performance(
parameter
Symbol
Typical value
Unit
G660-5mWF
-03BCK-S
G660-10mWF
-03BCK-S
G660-30mWF
-03BCK-S
G660-50mWF
-06BCK-ST
Optica 1
CW Output Power
Pop
5
10
30
50
mW
Center Wavelength
λc
660±5
nm
Spectral Width (90% of Power)
△λ
<3
nm
Wavelength Shift with Temperature
△λ/△T
0.2
nm/C
Electrica1
Threshold Current
lth
35
35
55
85
m A
Operating Current
lop
55
70
150
250
m A
Operating Voltage
Vop
2.2-2.4
V
TEC Max Current
It
-
-
-
1.8
A
TEC Max Voltage
Vt
-
-
-
3.2
V
Thermistor
Rt
-
-
-
10±5%/3477
(KQ) /p (25°C)
Slope Efficiency
ηes
0.3
0.3
0.3
0.3
mW/mA
Fiber
Core Diameter
dcore
4
μm
Cladding Diameter
dclad
125
μm
Buffer Diameter
dbuffer
250
μm
Numerical Aperture
NA
0.13
-
Connector
L
FC,ST,SMA905
-
Parameter
Operating
Temperature /°C
Storage
Temperature ,C
Storage
Relative Humidity ,C
Lead
Soldering Temperature,10s max/ °C
Min
10
-20
-
-
Max
30
80
90
250
Other Parameters
Operating
notes
Avoid eye exposure to direct or scattered
radiation.
ESD precautions must be taken.
Please connect pins to wires by solder instead
of using socket when operation current is higher than 6A.
Soldering point should be close to the root of
the pins. Soldering temperature should be lower than 260℃
and time shorter than 10 second.
Use constant current power supply. Avoid surge
current.
Laser diode must be used according to the
specifications.
Laser diode must work with good cooling.
A minimum bend radius should be 300 times
greater than the fiber cladding diameter.
Operation temperature is 10℃~ 30℃.
Storage: -20℃~ +70℃, all pins short-circuit.
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