Parameter
Recommended Operating Conditions* @CW, case mounted on heat sink at room temperature
Chip temperature | 20 | 25 | 30 | °C |
Forward current | 700 | mA | ||
Output power | 40 | mW | ||
*-recommended based on Max. Spectral width and flatness |
characteristic @CW,25°C,700mA
Parameter | Min. | Typ. | Max. | Unit |
Output power | 25 | mW | ||
Forward voltage | 1.7 | 2.1 | V | |
Average wavelength | 1045 | 1055 | 1065 | nm |
Bandwidth( FWHM) | 90 | 120 | nm | |
Ripple**( RMS) | 0.5 | dB | ||
Excitation state Max. position | 1000 | nm | ||
Ground state Max. position | 1085 | nm | ||
Spectral tilt | 5 | dB | ||
Polartization extinction ratio | 15 | 20 | dB | |
polarization | TE | |||
**-RMS in the range of 1nm, near ASEMax. value, resolution of 10pm |
Absolute Max. ratings
Parameter | Min | Max | Unit |
Output power | 150 | mW | |
Forward current | 800 | mA | |
Backward voltage | 2 | V | |
TEC current | 3 | A | |
TEC voltage | 4 | V | |
Chip operating temperature | 5 | 40 | °C |
Case operating temperature | 0 | 70 | °C |
Storage temperature | -40 | 85 | °C |
Fiber Band Radius | 3 | cm |
Typical performance (for reference only)
@CW, housing mounted on room temperature heat sink
Thermistor specifications Fiber optical specifications | ||||||
Parameters | Value | Unit | Parameters | Value | Value | Unit |
Type | NTC | Fiber type | HI1060 | PM980 | ||
Resistance @ 2 5°C | 10±0.1 | kΩ | Numerical aperture (Typical) | 0.14 | 0.12 | |
Beta 0-50°C | 3430±1% | K | Cut-off wavelength | 920±50 | 900±70 | nm |
![]() | Mode field diameter | 6.2±0.3 @1060nm | 6.6±0.3 @1060nm | |||
µm | ||||||
Cladding diameter | 125±1 | 125±1 | um | |||
Coating diameter | 245±15 | 245±15 | µm | |||
Loose tube diameter (optional) | 900 | 900 | ||||
µm | ||||||
connector | FC/APC | FC/APC | ||||
Key | narrow | narrow | ||||
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Safety and Operating Instructions
The light emitted by this device is invisible and can be harmful to the human eye. Avoid looking directly at the fiber connector while the device is operating. Appropriate laser safety glasses must be worn when operating with the connector open. The Max. ratings must only be applied to the device for short periods of time. Exposure to the Max. ratings for extended periods of time or exposure to more than one Max. rating may cause damage to the device or affect the reliability of the device. Operating the device outside the Max. ratings may cause device failure or safety hazards. The power supply used with the component must ensure that the Max. forward current cannot be exceeded.
A suitable heat sink is required for the device on the heat sink. The device must be mounted on the heat sink using 4 screws (tightened in an X-shaped manner with an initial torque setting of 0.075Nm and a final X-bolt tightening of 0.15Nm) or a clamp. The heat sink surface must have a deviation from flatness of less than 0.05mm. It is recommended to use indium foil or thermally conductive soft material as a thermal interface between the bottom of the housing and the heat sink. It is undesirable to use thermal grease for this purpose.
Avoid reflections from the back of the device. It may have an impact on the performance of the equipment in terms of spectrum and power stability. It may also cause fatal facet joint damage. It is highly recommended to use an optical isolator to block back reflections.
Do not pull on the fiber. Do not bend the fiber with a radius less than 3 cm. During installation, the top of the fiber should always be protected from any contamination or damage. After removing the dust cap covering the top of the fiber, use optical lens cleaning paper or cotton swabs dipped in isopropyl alcohol or ethanol to carefully wipe the top of the fiber in one direction. Only operate the equipment with clean fiber connectors.
Electrostatic discharge is the main cause of unexpected product failure. Take extreme precautions to prevent ESD. During equipment installation, ESD protection must be maintained - use a wrist strap, a grounded work surface, and strict anti-static techniques when handling products.