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850nm polarization locked single mode VCSEL chip laser
850nm polarization locked single mode VCSEL chip laser
Our single-mode VCSELs are designed to meet the stringent specifications of a wide range of optical sensing applications. They provide polarization-stabilized single-mode emission with a symmetrical Gaussian beam profile and typically 1mW output power. Bias currents range from 3 to 6mA.
Product features:Single transverse mode and single longitudinal mode、 Polarization-stabilized emission、 Low power consumption、 High reliability、 Gaussian beam profile、 Back cathode and top anode configuration、 RoHS certified
Application area:Laser mouse、 Optical sensor applications、 Photoelectric encoder
Unit Price
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Part Number
APA8501010001
Lead Time
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Stock
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General Parameters
Dimensional Drawing

Technical parameters:

Test conditions: temperature 25℃Operating conditions: Top = 5°- 45℃; Iop = const., set at 25℃ so that Pop = 0.55mW


Parameters

Symbol

Min.

Typ.

Max.

Unit

Note

Threshold current

ITH

1

3

5

mA

T = 25°C

Slope efficiency

η

0.20

0.40

0.65

mW/mA

T = 25°C, I = Ith+1mA

Operating current

IOP

2.3


6

mA

T = 25°C, Pop=0.55mW

Operating voltage

UOP



2.3

V

Working conditions

Differential resistance

Rd

20


90

Ω

T = 25°C,  Pop=0.55mW

SM optical output power

PSM

0.9



mW

T = 25°C

Side mode suppression ratio

SMSR

10



dB

T = 25°C, Pop=0.9mW

Polarization direction accuracy

δpo

-15


+15

deg

T = 25°C, Pop=0.2...0.9mW

Emitted wavelength

λpeak

840

850

860

nm

Working conditions

Beam divergence

θFW1/e2

13

17

21

deg

T = 25°C, Pop=0.5mW

Change of optical power with temperature

P(T) ‒ Pop

-200


+120

µW

Iop, T=5...45°C


SM = Single Mode; FW1/e2 = Full Width 1/e2

 

 

Absolute Maximum Ratings:

Parameters

Max

Unit

Note

Continuous operating current

8

mA

3

Continuous reverse voltage

8

V


PCB solder or reflow temperature

260

°C

Up to 10 seconds

 

 

Package size: chip size

Parameters

Min.

Typ.

Max.

Note

Chip width

135

155

175

µm

Chip length

135

155

175

µm

Chip thickness

135

150

165

µm

 


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