Technical parameters:
Test conditions: temperature 25℃Operating conditions: Top = 5°- 45℃; Iop = const., set at 25℃ so that Pop = 0.55mW
Parameters | Symbol | Min. | Typ. | Max. | Unit | Note |
Threshold current | ITH | 1 | 3 | 5 | mA | T = 25°C |
Slope efficiency | η | 0.20 | 0.40 | 0.65 | mW/mA | T = 25°C, I = Ith+1mA |
Operating current | IOP | 2.3 | 6 | mA | T = 25°C, Pop=0.55mW | |
Operating voltage | UOP | 2.3 | V | Working conditions | ||
Differential resistance | Rd | 20 | 90 | Ω | T = 25°C, Pop=0.55mW | |
SM optical output power | PSM | 0.9 | mW | T = 25°C | ||
Side mode suppression ratio | SMSR | 10 | dB | T = 25°C, Pop=0.9mW | ||
Polarization direction accuracy | δpo | -15 | +15 | deg | T = 25°C, Pop=0.2...0.9mW | |
Emitted wavelength | λpeak | 840 | 850 | 860 | nm | Working conditions |
Beam divergence | θFW1/e2 | 13 | 17 | 21 | deg | T = 25°C, Pop=0.5mW |
Change of optical power with temperature | P(T) ‒ Pop | -200 | +120 | µW | Iop, T=5...45°C |
SM = Single Mode; FW1/e2 = Full Width 1/e2
Absolute Maximum Ratings:
Parameters | Max | Unit | Note |
Continuous operating current | 8 | mA | 3 |
Continuous reverse voltage | 8 | V | |
PCB solder or reflow temperature | 260 | °C | Up to 10 seconds |
Package size: chip size
Parameters | Min. | Typ. | Max. | Note |
Chip width | 135 | 155 | 175 | µm |
Chip length | 135 | 155 | 175 | µm |
Chip thickness | 135 | 150 | 165 | µm |