Parameters
Parameters | Value |
Center wavelength (nm) | 808±5nm |
Continuous output power (mW) | >30mw |
Spectral width | 0.5-2nm |
Fiber core | 6um |
Numerical aperture (NA) | 0.12 |
Fiber length | 0.8m |
Connector | FC/APC |
Operating voltage | 1.8-2.3V |
Threshold current | 35mA |
Maximum operating current | 140mA |
Monitoring current | 0.5mA |
Differential efficiency | 0.9mw/mA |
PD reverse breakdown voltage | 30V |
Package type | Coaxial package |
pin definition
1 | LD+ |
2 | LD-/PD+ |
3 | PD- |
Limited Parameters
Name | Symbol | Unit | Min | Typ | Max | Conditions |
Shell Temperature | TOP | ℃ | -5 | 25 | 70 | |
Forward Operating Voltage | VR | V | 1.8 | 2 | 2.3 | |
Axial Pull Force | N | - | - | 5N | 3x10s | |
Lateral Pull Force | N | - | - | 2.5N | 3x10s | |
Fiber Bending Radius | 16mm | - | ||||
Reverse Operating Voltage (LD) | VLD | V | - | - | 2 | HBM |
Soldering Time | S | - | 10s | 260℃ | ||
Storage Temperature | TSTG | ℃ | -40 | - | +85 | 2000hr |
Operating Temperature | TOP | ℃ | -55 | - | +125 | |
Relative Humidity | RH | 5% | - | 95% | Noncondensing |
Precautions
1.Avoid direct laser exposure to the eyes and skin while the laser is operating. Even weak laser light entering the eye can cause serious damage due to the focusing effect of the eye.
2. The laser requires a stable driving power supply to avoid surges, and the instantaneous reverse current and reverse voltage should not exceed the limit value, otherwise it will damage the components.
3. Semiconductor lasers are sensitive to temperature. High operating temperatures reduce conversion efficiency and accelerate component aging. They should be used with adequate heat dissipation or cooling.
4.The laser should be operated at the rated current and power. Exceeding the rated output power can accelerate component aging.
5.The laser is an electrostatic-sensitive device. Anti-static measures must be taken during transport, storage, and use.
6.The laser should be stored or operated in a dry, well-ventilated environment to prevent condensation that could damage the laser.
7.The cavity surface is one of the key parts of the laser. Any operation that damages the cavity should be avoided. During use, the chip must be kept free from contamination and mechanical damage.
8.The fiber should not be sharply bent. The bending radius should be greater than 300 times the fiber diameter.